|
File Name |
File Title |
Working Group |
Projects |
Date |
author |
|
Chen_FF_01a_221019.pdf |
Updating the management interface protocol of DSFP module |
Form Factor WG |
Next-Generation Wireless Fronthaul Module Encapsulation |
2022-10-18 |
tom.issenhuth@ipec-std.org |
|
Chen_FF_02_220610.pdf |
MFH50 Memory Map of Duplex and Bidi Module |
Form Factor WG |
Next-Generation Wireless Fronthaul Module Encapsulation |
2022-06-14 |
tom.issenhuth@ipec-std.org |
|
Chen_FF_01_220610.pdf |
MFH50 SFP56 Module Manager Feature and Memory Map definition |
Form Factor WG |
Next-Generation Wireless Fronthaul Module Encapsulation |
2022-06-14 |
tom.issenhuth@ipec-std.org |
|
Pan_FF_01a_220114.pdf |
Rate Switching Delay of 50G PAM4 DSP in new 50G Optical Module |
Form Factor WG |
Next-Generation Wireless Fronthaul Module Encapsulation |
2022-01-17 |
tom.issenhuth@ipec-std.org |
|
Pan_FF_02a_220114.pdf |
Introduction of Latency of 50G PAM4 DSP in new 50G Optical Module |
Form Factor WG |
Next-Generation Wireless Fronthaul Module Encapsulation |
2022-01-17 |
tom.issenhuth@ipec-std.org |
|
Chi_FF_01_220114.pdf |
DSFP56 a new 50G Optical Module Solution |
Form Factor WG |
Next-Generation Wireless Fronthaul Module Encapsulation |
2022-01-17 |
tom.issenhuth@ipec-std.org |
|
He_FF_01_20114.pdf |
Calibration and Acceptance Solution of Swing/cursor on TP4 |
Form Factor WG |
Next-Generation Wireless Fronthaul Module Encapsulation |
2022-01-17 |
tom.issenhuth@ipec-std.org |
|
Zhang_FF_01a_220114-1.pdf |
Electrical parameter the SFP56 slow down to 25GBPS |
Form Factor WG |
Next-Generation Wireless Fronthaul Module Encapsulation |
2022-01-17 |
tom.issenhuth@ipec-std.org |
|
Pan_FF_02_220114.pdf |
Introduction of Latency of 50G PAM4 DSP |
Form Factor WG |
Next-Generation Wireless Fronthaul Module Encapsulation |
2022-01-14 |
tom.issenhuth@ipec-std.org |
|
Pan_FF_01_220114.pdf |
Rate Switching Delay of 50G PAM4 DSP |
Form Factor WG |
Next-Generation Wireless Fronthaul Module Encapsulation |
2022-01-14 |
tom.issenhuth@ipec-std.org |
|
Chen_FF_01_220114.pdf |
DSFP56 a new 50G Optical Module Solution |
Form Factor WG |
Next-Generation Wireless Fronthaul Module Encapsulation |
2022-01-14 |
tom.issenhuth@ipec-std.org |
|
Zhang_FF_02_220114.pdf |
Calibration and Acceptance Solution of Swing/cursor on TP4 |
Form Factor WG |
Next-Generation Wireless Fronthaul Module Encapsulation |
2022-01-14 |
tom.issenhuth@ipec-std.org |
|
Zhang_FF_01_220114.pdf |
Electrical parameter the SFP56 slow down to 25GBPS |
Form Factor WG |
Next-Generation Wireless Fronthaul Module Encapsulation |
2022-01-14 |
tom.issenhuth@ipec-std.org |
|
Chen_FF_01_211210.pdf |
50G SFP electrical Interface |
Form Factor WG |
Next-Generation Wireless Fronthaul Module Encapsulation |
2021-12-09 |
tom.issenhuth@ipec-std.org |